Category: Technical Packaging




The Joint Electronic Device Engineering Council (JEDEC) have a standard mechanism for the transportation of electronic components. This packaging design solution was developed to deliver a cheaper, lighter standard tray thus reducing freight costs and is in field trials with Microchip.

  • Made from recycled and recyclable materials
  • 1/3 of weight and 1/2 the price of existing tray solutions
  • Reduced individual tray cost
  • Reduced weight lowers shipping costs and carbon footprint

Cyberpac have been working with sister company, Antistat, who specialise in ESD Protection, for further details on this type of project please contact Antistat direct on +44 (0)1473 836200 or visit their website at www.antistat.co.uk.


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