Peel Pack Solution

Innovative, patented Integrated Circuit packaging reducing time, waste and cost.

Utilising medical, static safe technology to solve the problems associated with repackaging and distributing Original Equipment Manufacturer (OEM) ICs into smaller shipping quantities.

• Eradicates pin damage

• Reduction in customer complaints

• Customer satisfaction rates increase

• Improved bin accuracy and reduced product damage

• Reduced packaging cost and dunnage due to smaller footprint

• Reduced packaging time

• Made from recycled material and is recyclable